DEVICE FOR INSPECTING BONDED WAFER USING LASER

摘要

Disclosed is a device for inspecting a bonded wafer using a laser, which is formed in a simple structure, simplifying the operations thereof, and may detect faults in the boundary surfaces of the bonded wafer economically and reliably. To this end, the device for inspecting a bonded wafer using a laser includes a laser means, a laser diffusion means, and a detection means. According to the device for inspecting a bonded wafer using a laser according to the present invention, it is possible to inspect the boundary surfaces of the wafer with the magnification desired by an inspector. In addition, due to the simple structure thereof, the operation for the inspection becomes easy.