| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device that can be manufactured by a simple manufacturing process and reduced in color unevenness caused by variation of a radiation angle and a manufacturing method for the same. <P>SOLUTION: Under a state that an LED element 13 from which a sapphire substrate 73 is exfoliated is flip-chip-mounted on a circuit board 12, the circuit board 12 and LED 13 are covered by a phosphor sheet 11. Emission light from the side surface of the LED element 13 is reduced and thus color unevenness is lessened because the sapphire substrate 73 is removed. The surface of the circuit board 12 is substantially flattened and thus attachment of the phosphor sheet 11 can be facilitated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
