DOUBLE SIDE PROBING OF SEMICONDUCTOR DEVICES

摘要

PROBLEM TO BE SOLVED: To prevent interference from adjoining LEDs from influencing the electrical and optical data acquired during wafer stage test.

SOLUTION: A probe head for testing the properties of a semiconductor device (10) under test includes a dielectric film (24) supporting at least one semiconductor device (10) under test with a support frame (26) tautly supporting the dielectric film (24). A first support (40) positions a first probe (28) for electrically contacting a first side (16) of the semiconductor device (10) under test and a second support (34), having an actuator to move a second probe (30) between a first position (P1) and a second position (P2), positions the second probe (30) with the second position (P2) being for electrically contacting an opposing second side (18) of the semiconductor device under test.

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