| 摘要 |
<p>A light emitting diode(LED) encapsulation structure with simple structure relates to the technology of LED encapsulation, and comprises a substrate(1) and an insulating layer(2), wherein a plurality of installation areas(3) and a plurality of through holes(4) are formed on the substrate(1). The insulating layer(2) is formed at a time in the way that plastic cement is covered on the substrate(1) except for the installation areas(3) and poured into all the through holes(4) in the mode of injection molding, and meanwhile, pit-shaped installation grooves(5) with the functions of installation and light reflection are formed on the substrate(1), with the installation areas(3) as the bottom surfaces of the installation grooves(5); installation bases(6) and electrode points(7) are arranged on installation areas(3), namely the bottom surfaces of the installation grooves(5); LED luminescence chips(8) are mounted on the installation bases(6); buckles(9) with the function of clamping and connecting are arranged at the openings of the installation grooves(5); and light transmitting bodies(10) arranged on the installation grooves(5) are connected with the installation grooves(5) in a clamping manner through the buckles(9). The LED encapsulation structure has the benefits of simple encapsulation structure and encapsulation process, good effect, high production efficiency, suitability for large-scale production and very reliable product quality.</p> |
