ADHESIVE TAPE FOR PROCESSING RIGID WAFERS AND GRINDING METHOD USING SAME

摘要

The disclosed adhesive tape for processing rigid wafers has a radiation-curable adhesive layer on top of a base resin film layer that contains a polyester. Prior to radiation curing, the disclosed adhesive tape exhibits compressive displacement between 30 and 92 µm and an adhesive strength, with respect to a mirror surface of a silicon wafer, between 2.5 and 29.8 N/25 mm.