| 摘要 |
<P>PROBLEM TO BE SOLVED: To peel a support plate from a wafer in an easier manner. <P>SOLUTION: In the peeling method of this invention, a support plate 3 is peeled from a wafer 2 where the support plate 3 is stuck by means of an adhesive layer 4 formed with an adhesive compound showing a solubility with respect to non-polar solvents or an adhesive compound showing a solubility with respect to high-polarity solvents. The peeling method includes the process to supply the non-polar solvents or the high-polarity solvents to the adhesive layer 4. Therefore, it is not necessary to protect a dicing tape 5 stuck to the wafer 2 when solvents are supplied. <P>COPYRIGHT: (C)2012,JPO&INPIT |
