| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide at low price, a high-temperature lead-free solder material which contains no lead, gold or the like, prevents deterioration with time resulting from oxidation or corrosion corresponding to high-temperature soldering needing a liquidus temperature of about 250 to 400°C, and has high reliability. <P>SOLUTION: The lead-free solder material comprises 15-92 wt.% Zn, ≤0.1 wt.% Mn (excluding zero as a lower limit value in a range) and the balance Sn with inevitable impurities. The solder material has excellent soldering properties, has high liquidus temperature corresponding to soldering in the temperature range of 250 to 400°C, and further prevents deterioration with time resulting from oxidation or corrosion in a soldered joint. The joining strength of the soldered joint can be further improved by adding ≤1 wt.% of Al (excluding zero as a lower limit value in the range) to the above composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
