| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new solder alloy which can allow oxide materials to be joined to each other at low temperature and can suppress a temporal change being a white turbidity phenomenon, which is believed to be caused when the solder alloy is oxidized, while keeping the characteristics of a Sn-Bi-Mg-based solder alloy having excellent joint strength and airtightness. <P>SOLUTION: The new solder alloy comprises 30.0-70.0 mass% Bi, 0.01-1.00 mass% Mg, 0.05-5.00 mass% Sb and the balance of Sn and inevitable impurities and satisfies a Mg/Sb ratio of 0.01-0.40. <P>COPYRIGHT: (C)2012,JPO&INPIT |
