发明名称 THERMAL MODULE AND METHOD OF MANUFACTURING THE SAME
摘要 A thermal module and a method of manufacturing the same are disclosed. The thermal module includes a first heat dissipation member, a second heat dissipation member, a binding layer, and a metal layer. The first heat dissipation member can be a heat dissipating substrate, and the second heat dissipation member can be a heat pipe or a heat dissipating substrate. The metal layer is coated on the first heat dissipation member through a metal spray process. The binding layer can be a solder paste. By providing the spray-coated metal layer, the thermal module can have upgraded heat dissipation efficiency, increased pull strength, and reduced manufacturing cost.
申请公布号 US2011277963(A1) 申请公布日期 2011.11.17
申请号 US20100778147 申请日期 2010.05.12
申请人 CHIOU YAU-HUNG;FAN SHU-HUI;CHUANG YUAN-LI;CHENMING MOLD IND. CORP. 发明人 CHIOU YAU-HUNG;FAN SHU-HUI;CHUANG YUAN-LI
分类号 H01L23/36;B21D53/02;H01L23/427;H01L23/467 主分类号 H01L23/36
代理机构 代理人
主权项
地址