发明名称 |
SYSTEM AND METHOD FOR TESTING OF BONDS OF A SEMICONDUCTOR ASSEMBLY |
摘要 |
An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe including a straight, thermally conductive pin; a heater for heating a tip of the probe; a holder for supporting the probe and including a clamping mechanism that is configured to provide a clamping force on the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond.
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申请公布号 |
US2011277556(A1) |
申请公布日期 |
2011.11.17 |
申请号 |
US201113093264 |
申请日期 |
2011.04.25 |
申请人 |
PEECOCK BENJAMIN K.;KING PHILIP JOHN;NORDSON CORPORATION |
发明人 |
PEECOCK BENJAMIN K.;KING PHILIP JOHN |
分类号 |
G01N3/08 |
主分类号 |
G01N3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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