COATING METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, AND COATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To uniformly apply a coating liquid on the surface of a substrate while decreasing the quantity of the coating liquid to be applied in the application of the coating liquid on the substrate using a spin coating method.

SOLUTION: A coating method includes: a coating step S3 of applying a resist liquid on a wafer by discharging the resist liquid from the nozzle to a central portion of the wafer while acceleratingly rotating the wafer; a flattening step S4 of then decelerating the rotation of the wafer to flatten the resist liquid on the wafer; and a drying step S5 of drying the resist liquid on the wafer by accelerating rotating the wafer. In the coating step S3, the acceleration of the rotation of the wafer is changed in the order of a first acceleration, a second acceleration higher than the first acceleration, and a third acceleration lower than the second acceleration to acceleratingly rotate the wafer at all times.

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