| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily measure and test electric and optical characteristics of each chip component with multiple chip components installed on a substrate instead of dividing the chip components into individual pieces, and with a device configuration greatly simplified. <P>SOLUTION: The electronic component operation function measuring device and the method for measuring electronic component operation function include: an electronic component side surface separation step in which a roll 51, which is an electronic component side surface separation means 5, bends an electronic component substrate 3 along curved surfaces and corner parts and makes the substrate separate the side surfaces of LED chips 21 adjacent to the substrate in the front and rear, a terminal connection step in which terminal connection means 6 connects the specified terminals of the LED chips 21, and an electric operation function measuring step in which an electric operation function measuring means 7 measures an electric operation function of one or multiple LED chips 21 which are connected via the terminal connection means 6 to the electric operation function measuring means 7, with the one or multiple electronic components driven. <P>COPYRIGHT: (C)2012,JPO&INPIT |
