发明名称 SEMICONDUCTOR PRESSURE SENSOR
摘要 A semiconductor pressure sensor that can improve diaphragm breakage pressure tolerance is provided. Included are: a first semiconductor substrate on which is formed a recess portion that has an opening on a first surface in a thickness direction; a second semiconductor substrate that is disposed so as to face the first surface of the first semiconductor substrate; and a first silicon oxide film that is interposed between the first semiconductor substrate and the second semiconductor substrate, and on which is formed a penetrating aperture that communicates between the recess portion and the second semiconductor substrate, and at least a portion of an edge portion of the penetrating aperture is positioned inside an opening edge portion of the recess portion when viewed from a side facing the penetrating aperture and the opening of the recess portion.
申请公布号 US2011278685(A1) 申请公布日期 2011.11.17
申请号 US20100949459 申请日期 2010.11.18
申请人 YOSHIKAWA EIJI;IZUO SHINICHI;MITSUBISHI ELECTRIC CORPORATION 发明人 YOSHIKAWA EIJI;IZUO SHINICHI
分类号 H01L29/84 主分类号 H01L29/84
代理机构 代理人
主权项
地址