发明名称 METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE
摘要 A method for manufacturing a silicon carbide substrate includes the steps of: preparing a SiC substrate made of single-crystal silicon carbide; disposing a base substrate in a crucible so as to face a main surface of the SiC substrate; and forming a base layer made of silicon carbide in contact with the main surface of the SiC substrate by heating the base substrate in the crucible to fall within a range of temperature equal to or higher than a sublimation temperature of silicon carbide constituting the base substrate. The crucible has an inner wall at least a portion of which is provided with a coating layer made of silicon carbide.
申请公布号 US2011278594(A1) 申请公布日期 2011.11.17
申请号 US201113104247 申请日期 2011.05.10
申请人 NISHIGUCHI TARO;SASAKI MAKOTO;HARADA SHIN;OKITA KYOKO;INOUE HIROKI;NAMIKAWA YASUO;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 NISHIGUCHI TARO;SASAKI MAKOTO;HARADA SHIN;OKITA KYOKO;INOUE HIROKI;NAMIKAWA YASUO
分类号 H01L29/12;B32B13/04;C30B23/02;H01L21/20 主分类号 H01L29/12
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