| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable to suppress the reduction of yield due to dust falling onto an adherend such as a semiconductor wafer. <P>SOLUTION: A sheet peeling apparatus 10 makes supporting means 11 supporting a semiconductor wafer W and a peeling tape PT relatively move by moving means 15 to peel an adhesive sheet S away from the semiconductor wafer W. In this peeling step, peeling attitude formation means 14 contacts with an adhesive surface of the adhesive sheet peeled away so as to oppose to unpeeled adhesive sheet S. The peeling attitude formation means 14 presses the semiconductor wafer W to the supporting means 11 side by the elastic force of the adhesive sheet S to form the peeling attitude of the adhesive sheet S. When the adhesive sheet S is peeled away, controlling means 17 controls the operation of the moving means 15 so that a folded sheet part is formed between the peeling attitude formation means 14 and the semiconductor wafer W from which the adhesive sheet S is peeled away in a planar view. <P>COPYRIGHT: (C)2012,JPO&INPIT |
