| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming an adhesive layer, which stably forms an adhesive layer of a thin film and a thermosetting composition that does not cause voids or even if voids occur, allows voids to disappear or minimizes voids until packaged when a semiconductor chip with an adhesive is thermocompression-bonded. <P>SOLUTION: The method for forming an adhesive layer includes a coating step for selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device and a solvent removal step for removing the solvent of the adhesive composition coated on the surface to be bonded. The thermosetting composition has two kinds of curing properties having different reaction temperatures. The adhesive composition has a reaction between an epoxy resin and an epoxy curing agent which have a first curing reaction having a DSC peak at 100-160°C and a second curing reaction composed of a self-polymerization reaction of the epoxy resin and having a DSC peak at 140-200°C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
