发明名称 |
PACKAGE STRUCTURE AND PACKAGE PROCESS OF LIGHT EMITTING DIODE |
摘要 |
A light emitting diode (LED) package structure comprising a carrier, an LED chip, a first encapsulant, at least one bonding wire, a plurality of phosphor particles and a second encapsulant is provided. The LED chip is disposed on the carrier. The LED chip has at least one electrode. The first encapsulant is disposed on the carrier and covering the LED chip. The first encapsulant is provided with at least one preformed opening exposing at least a portion of the at least one electrode. The at least one bonding wire is electrically connected between the at least one electrode and the carrier via the at least one preformed opening. The phosphor particles are distributed within the first encapsulant. The second encapsulant is disposed on the carrier and encapsulates the LED chip, the first encapsulant and the at least one bonding wire. |
申请公布号 |
US2011278610(A1) |
申请公布日期 |
2011.11.17 |
申请号 |
US20100777525 |
申请日期 |
2010.05.11 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
JEONG HYUNSOO;LEE SEONGOO;PARK RYUNGSHIK;LEE HYUNIL |
分类号 |
H01L33/52;H01L33/44;H01L33/62 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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