发明名称 PROCESS FOR PRODUCING A CHIP USING A MOLD
摘要 A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
申请公布号 US2011278259(A1) 申请公布日期 2011.11.17
申请号 US201113175071 申请日期 2011.07.01
申请人 TERASAKI ATSUNORI;SEKI JUNICHI;SUEHIRA NOBUHITO;INA HIDEKI;OKUSHIMA SHINGO;CANON KABUSHIKI KAISHA 发明人 TERASAKI ATSUNORI;SEKI JUNICHI;SUEHIRA NOBUHITO;INA HIDEKI;OKUSHIMA SHINGO
分类号 C03C15/00 主分类号 C03C15/00
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