| 摘要 |
PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to perform a junction process of an active device and passive device at the same time by arranging a composite type bump performing a solder pad function with a solder bump, thereby improving productivity by simplifying processes. CONSTITUTION: A first metal layer(110) is arranged on a carrier(120). The carrier comprises a copper foil layer(121), an adhesive material(122), and a support insulating layer(123). A composite type bump(130) is arranged on the upper surface of the first metal layer. The composite type bump performs solder bump and solder pad functions. A plurality of chips including an active device chips is mounted on the composite type bump.
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