RINSING AND DRYING DEVICE OF CHEMICAL MECHANICAL POLISHING SYSTEM

摘要

PURPOSE: A device for rinsing and drying a substrate of a chemical mechanical polishing system is provided to improve a rinsing effect by suppressing an eddy on the surface of a substrate which rotates at high speed. CONSTITUTION: A cover(110) surrounds a rotary substrate with a cylindrical shape. The upper side of the cover has a height of 1 mm to 10 mm from the substrate. A substrate holder(120) mounts the substrate on a fixing plate(122) and is driven. A driving motor transmits rotary driving power to a rotation shaft(142) through a reduction gear. A deionized water supply unit supplies deionized water(88a) to the rotation center of the substrate.