| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting devices on a board so as to obtain a strong bond between a wiring board and device electrodes by using electrolytic plating. <P>SOLUTION: A seed metal wiring layer 4 is formed on a trio board 2, and an LED chip 3 is temporarily secured to the trio board 2 in such a way that the LED chip 3 is located above the seed metal wiring layer 4, with its electrode pads (3P, 3N) not electrically connected thereto, and then electrolytic plating is applied, where the seed metal wiring layer 4 serves as a power feeding layer. At this time, plating starts growing from the seed metal and, after an electrical contact, plating grows over a plated layer which has already been formed and an electrode pad surface as one growth plane. For one electrode pad, it is possible to carry out growth of seamless plating without joining faces or gaps due to growth of discontinuous plating from plural portions. This ensures that the LED chip 3 is firmly secured to the wiring board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
