METAL-CLAD LAMINATE, PHOTOELECTRIC COMPOSITE WIRING BOARD, METHOD FOR MANUFACTURING METAL-CLAD LAMINATE, AND METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photoelectric composite wiring board that increases adhesion of an electric circuit and suppresses coupling loss between a light receiving/emitting element and an optical waveguide.

SOLUTION: A photoelectric composite wiring board 20 having an optical circuit 6 and an electric circuit 10 is manufactured by a manufacturing method including a resin layer forming step for forming a resin layer 8d containing epoxy resin 8a and a rubber particle 8b composed of transparent resin different from the epoxy resin 8a on an optical waveguide 6 having a core 3 and a clad 25 surrounding the core 3, an etching processing step for etching-processing the formed resin layer 8d, a metal layer forming step for forming a metal layer 9d by metal-plating 9 on the etching-processed resin layer 8d, and an electric circuit forming step for forming the formed metal layer 9d into the electric circuit 10.

COPYRIGHT: (C)2012,JPO&INPIT