发明名称 |
SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLUDING THE SEMICONDUCTOR CHIP |
摘要 |
A semiconductor chip includes a redistribution interconnect that is implemented by shorting bumps, and a semiconductor package and a system each including the semiconductor chip. The semiconductor chip includes a semiconductor substrate, a passivation film disposed on the semiconductor substrate, and a plurality of pseudo bumps disposed on the passivation film. Each pseudo bump is directly connected to adjacent pseudo bumps to form at least one redistribution interconnect. |
申请公布号 |
US2011283034(A1) |
申请公布日期 |
2011.11.17 |
申请号 |
US201113076605 |
申请日期 |
2011.03.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG SUN-WON;LIM HWAN-SIK |
分类号 |
H01L23/498;G06F13/14 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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