| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dielectric layer and/or a dielectric composition that could be processed at lower temperatures and/or shorter time periods. <P>SOLUTION: A process for fabricating an electronic device comprises: depositing a dielectric composition, which comprises a dielectric material, a crosslinking agent, and an infrared absorbing agent, on a substrate; exposing the dielectric composition to infrared radiation to cure the dielectric composition to form a dielectric layer on the substrate; and forming a semiconductor layer on the substrate. Further, the electronic device comprises a dielectric material layer comprising a dielectric material and an infrared absorbing agent that are crosslinked. <P>COPYRIGHT: (C)2012,JPO&INPIT |
