| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure of printed wiring boards, which can form a fine pitch of electrodes and achieve both of insulating properties and connection reliability. <P>SOLUTION: In the connection structure of printed wiring boards 10, 20, first electrodes 12, 13 formed on a first substrate 11, and second electrodes 22, 23 formed on a second substrate 21 are electrically connected through adhesive 30 containing conductive particles 31. An adhesive layer 30a is formed between the first substrate 11 and the second substrate 21, and on the adhesive layer 30a, a gap part 33 is formed between the electrodes 12, 13 and between the electrodes 22, 23, and the adhesive 30 is formed on the whole surface of the first substrate 11 and the whole surface of the second substrate 21 between the electrodes 12, 13 and between the electrodes 22, 23. The gap part 33 is formed so that an extending direction of the electrodes 12, 13, 22, 23 is the longitudinal direction of the gap part 33 between the electrodes 12, 13 and between the electrodes 13, 23. <P>COPYRIGHT: (C)2012,JPO&INPIT |
