发明名称 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To stably deliver a thin paper-like processing target such as a semiconductor wafer or the like by using a robot hand. <P>SOLUTION: An apparatus 1 for manufacturing a semiconductor device has an accommodating unit 2 for accommodating a processing target W, and a feeding unit 3 which has a hand 3a for supporting the processing target W and feeds the processing target W accommodated in the accommodating unit 2 by the hand 3a. The accommodating unit 2 has a support plate having plural support portions for supporting the processing target W arranged in a comb-shape, and the hand 3a has plural support portions for supporting the processing target W. The support portions of the hand 3a are arranged in such a comb-shape as to intrude into the gaps between the respective support portions of the support plate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011233574(A) 申请公布日期 2011.11.17
申请号 JP20100100025 申请日期 2010.04.23
申请人 SHIBAURA MECHATRONICS CORP 发明人 HARA AKIRA;TAMAI SHINGO;SHIGEYAMA AKIHIRO;OGAWA MICHIO;AOYAGI HITOSHI;TANAKA HIROYUKI
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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