| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating liquid for polymer fibers which makes a plated film excellent in adhesion and conductivity; and to provide a method for plating polymer fibers using the same and a method for producing the same. <P>SOLUTION: The plating liquid for polymer fibers includes: (1) a prescribed amount of CuSO<SB POS="POST">4</SB>-5H<SB POS="POST">2</SB>O as a component which contains a metal formed as a conductive film; (2) a prescribed amount of EDTA-4Na as a chelating agent; (3) a prescribed amount of NaOH as a pH adjusting agent; (4) a prescribed amount of HCHO as a reducing agent; (5) a prescribed amount of nonionic surfactant or polyethylene glycol as a surfactant; (6) a prescribed amount of KCN, 0-phenanthroline, neocuproin or 2,2-bipyridyl, as a decomposition inhibitor; (7) a prescribed amount of at least one compound selected from NiSO<SB POS="POST">4</SB>-6H<SB POS="POST">2</SB>O, CoSO<SB POS="POST">4</SB>-7H<SB POS="POST">2</SB>O, ZnSO<SB POS="POST">4</SB>-7H<SB POS="POST">2</SB>O, SnSO<SB POS="POST">4</SB>and Na<SB POS="POST">2</SB>O<SB POS="POST">3</SB>Sn-3H<SB POS="POST">2</SB>O, as an additive. <P>COPYRIGHT: (C)2012,JPO&INPIT |
