发明名称 METHOD OF MANUFACTURING STAMPER
摘要 <P>PROBLEM TO BE SOLVED: To provide a stamper excellent in releasability and durability. <P>SOLUTION: In a method of forming the stamper, a substrate, a conductive underlayer having catalytic activity and projecting patterns having no catalytic activity are sequentially formed. Stamper projections are formed by depositing an amorphous conductive layer between the projecting patterns and in a region in which the conductive underlayer is exposed by electroless plating using a master having a region in which the conductive underlayer having catalytic activity is exposed. Electroplating is performed on the stamper projections comprising projecting patterns and the amorphous conductive layer by using the amorphous conductive layer and the conductive underlayer as electrodes to form a stamper body formed of a crystalline metal. In the stamper forming method, the stamper having the stamper projections and the stamper body is released from the master. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011230362(A) 申请公布日期 2011.11.17
申请号 JP20100102572 申请日期 2010.04.27
申请人 TOSHIBA CORP 发明人 SAKURAI MASATOSHI;SHIMADA TAKUYA;SUGIMURA SHINOBU;SHIRATORI SATOSHI
分类号 B29C33/38;G11B5/82;G11B5/84;G11B7/26 主分类号 B29C33/38
代理机构 代理人
主权项
地址