| 摘要 |
A multilayer wiring board is inhibited from being warped when flip-chip bonding a semiconductor device to the multilayer wiring board, thereby increasing the reliability of connecting the semiconductor assembly to a motherboard. A heat-insulating layer 10 is provided between a core board 1 and a flip-chip bonding-side insulating layer 3 in a multilayer wiring board MB1, thereby preventing thermal conduction from a heat tool, so that the amounts of thermal expansion of the core board 1 and an insulating layer 4 are minimized, resulting in reduced warpage of the multilayer wiring board MB1.
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