SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

摘要

Disclosed is a semiconductor device that has high reliability and high utility, and that can be produced at a low cost. The semiconductor device (100) is provided with: a semiconductor chip (110), of which at least one functional element (111) is formed to the surface thereof; a spacer member (120) that comprises a frame structure provided on the semiconductor chip (110); and a cover member (130) that is provided on the spacer member (120). The semiconductor chip (110), the spacer member (120), and the cover member (130) form at least one hollow section (170) that faces at least one functional element (111), and the semiconductor chip (110) has at least one through hole (113) that reaches from the back surface or the side surface thereof to the hollow section (170).