PURPOSE: A squeeze module is provided to improve the print process performance of a solder paste by controlling the angle of a squeeze according to an amount of solder paste. CONSTITUTION: A rotation unit(110) bi-directionally rotates when a module is driven. A support rod(120) is mounted on both sides of the rotation unit. A squeeze holder(130) supports the vertical movement of the support rod. A squeeze blade(140) controls the bonding quantity of the solder paste and is fixed to the squeeze holder.
申请公布号
KR101084922(B1)
申请公布日期
2011.11.17
申请号
KR20100082955
申请日期
2010.08.26
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
PARK, YEO IL;MUN, SEON JAE;PARK, JUN HYEONG;KIM, SEUNG WAN;KIM, SUN MOON;KIM, DONG SUN;BEAK, SEUNG HO;LEE, CHANG HEE