| 摘要 |
A hot-melt pressure-sensitive adhesive (HMPSA) composition is provided including a) 25 to 50% of a styrene block copolymer chosen from SIS, SIBS, SEBS or SEPS block copolymers; b) 35 to 75% of a compatible tackifying resin having a softening temperature of between 80 and 150° C. and an acid number of less than 20; and c) 0.5 to 20% of one or more carboxylic acids, the hydrocarbon chain of which comprises 6 to 54 carbon atoms. A multilayer system including the HMPSA layer, a printable support layer and an adjacent protective layer is also provided. Corresponding self-adhesive label and process for recycling a labeled article, with debonding of said label by immersing the article in a hot basic aqueous solution is also provided.
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