RESIN COMPOSITION, RESIN COMPOSITION FOR INJECTION MOLDING, AND HOUSING FOR ELECTRIC/ELECTRONIC DEVICE

摘要

Disclosed is a resin composition that forms a molded body with superior moldability, bleedout resistance, and resistance to volatilization as well as superior bending elastic modulus and flame resistance. Specifically disclosed is a resin composition containing a cellulose ester and a group containing an ester bond such as the compound in the formula.