An implantable electrode device and a corresponding method of fabricating such a device are described. An electrode network of wires and contacts is developed by inkjet deposition of conductive metal material over portions of the electrode substrate for electrically connecting an implant processor device to targeted tissue in a patient. An electrode substrate beneath the electrode network provides structural support to the electrode network. A biocompatible encapsulation layer selectively covers a portion of the electrode network and provides electrical insulation for the covered portion of the electrode network while leaving exposed portions of the electrode network which allow electrical contact with adjacent tissue.
申请公布号
WO2010138567(A3)
申请公布日期
2011.11.17
申请号
WO2010US36173
申请日期
2010.05.26
申请人
MED-EL ELEKTROMEDIZINISCHE GERAETE GMBH;JOLLY, CLAUDE;NIELSEN, STEFAN, B.