发明名称 |
PROBE CARD AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
摘要 |
Provided is a probe card for LSI inspection that can achieve electrical conduction to electrodes on an LSI with a low load without damaging the electrodes and a structural body therebelow, even if the electrodes are arranged at a narrow pitch and in a complex manner. A contact terminal is formed in a truncated square pyramidal recess provided on a film-shaped probe. A dent is often formed on a surface of the film-shaped probe just above the contact terminal. A resin coating film is formed so as to eliminate the dent and flatten the surface of the film-shaped probe. At this time, it is preferred that an amount of cure shrinkage of a resin paste for forming the resin coating film is 0.1% or less. |
申请公布号 |
US2011281380(A1) |
申请公布日期 |
2011.11.17 |
申请号 |
US201113107317 |
申请日期 |
2011.05.13 |
申请人 |
NARIZUKA YASUNORI;TAKANE ETSUKO;HASEBE AKIO;RENESAS ELECTRONICS CORPORATION |
发明人 |
NARIZUKA YASUNORI;TAKANE ETSUKO;HASEBE AKIO |
分类号 |
H01L21/66;G01R31/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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