| 摘要 |
The present invention relates to a copper alloy having enhanced strength and electrical conductivity, which is provided with nickel and silicon as primary alloyed elements, with copper and unavoidable impurities forming the remainder, and titanium is added to the alloy in place of silicon in order to induce precipitation of nickel and intermetallic compounds, and a method for preparing the copper alloy. Additionally, the present invention relates to a semiconductor lead frame and a connector for electronic materials manufactured using the copper alloy. Furthermore, the present invention relates to a method for enhancing the strength and electrical conductivity of the copper alloy comprising the following steps: preparing an alloy including copper, nickel, and silicon, and adding a component that improves precipitation driving force; quenching the prepared alloy; generating a lamellar or fiber precipitate for all crystal-grains that make up the alloy by heat-treating the prepared alloy; and arranging the lamellar or fiber precipitate in one direction across the overall texture. |
