MASKING JIG, SUBSTRATE HEATING APPARATUS, AND FILM FORMATION METHOD

摘要

A cooler (30) is connected to the back surface (10b) of an insulating substrate (10). A masking jig (60) is used for defining the film formation area on which a coating film (41a) is to be formed when a copper powder (41) is sprayed onto the surface (10a) of the insulating substrate (10) by means of a cold spray apparatus (40) to form the coating film (41a). In the masking jig (60), an opening (63) for specifying the film formation area is formed, and a metal member (61) that contacts with the surface (10a) of the insulating substrate (10) is also formed. In the inside of the metal member (61), an electrically heating wire (70) that can heat an area adjacent to the opening (63) is provided. This constitution enables the cold spray apparatus (40) to spray the copper powder (41) onto the surface (10a) of the insulating substrate (10) while heating the surface (10a) of the insulating substrate (10) by an inexpensive structure, when the cooler (30) is connected previously to the back surface (10b) of the insulating substrate (10) that constitutes a power module.