| 摘要 |
PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to fundamentally not arrange an interface between an insulating layer and a solder fillet, thereby minimizing unnecessary stress. CONSTITUTION: A first metal layer(110) is arranged on a carrier(120). A dry film register(D) is applied on the upper surface of the first metal layer. The dry film register is patterned in order to include a developed region and un-developed region. A structure of a barrier rib structure capable of accepting metal paste is arranged on the first metal layer. The metal paste fills the inside a connection well.
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