| 摘要 |
<p>A three-dimension circuit device and the manufacture method thereof are provided. The method, involving a process of electroplating a conductive circuit on a non-conductive base (10), includes the steps as follows: the non-conductive base (10), a circuit pattern (20) on the base (10), conductive contacts (201) and lead electrical contacts (202), are formed by dual injection molding method; the circuit pattern (20) and the contacts are covered by a conductive interface layer (30); metal wires are formed on the circuit pattern (20) by electroplating; electroplating current is evenly distributed in the circuit pattern (20) by setting the conductive contacts (201) and the lead electrical contacts (202); the uniformity of the metal coating thickness is improved when the metal wires are formed by electroplating, and the method has the advantage of decreasing the cost of production and improving the productivity.</p> |
