INPUT DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

Disclosed are an input device and a method for manufacturing the same with which sealing and adhesion properties between a lower substrate and an upper substrate can be effectively improved in comparison with that achieved in the past. A pair of substrates are arranged opposing each other in the height direction. Each substrate comprises: a base material which has a transparent conductive layer formed on the surface thereof; and an electrode layer which is formed in a non-input region outside of an input region, on the surface of the base material. The substrates are joined by way of an adhesive layer. In the non-input region (20b) of the lower substrate (22), a first insulating layer (52) is formed at a step between lower electrode layers (32, 33) and a lower base material (50), a second insulating layer (53) is formed from the surface of the first insulating layer (52) to the surface of the lower electrode layers (32, 33), and the adhesive layer is provided on the surface side of the second insulating layer (53).