| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent deterioration of throughput when removing a reinforcing portion from a wafer, to restrain the increase of facility cost, and to prevent reduction of the number of chips produced per wafer. <P>SOLUTION: A device for processing wafer includes: a laser-processing stage 2 holding and rotating the wafer in such a state that the wafer is vertical or inclines at an optional angle; a laser head 3 for irradiating, with laser from a fixed position the boundary between the element area of the wafer held by the laser-processing stage 2 and the reinforcing portion thicker than the element area, or a region inside the boundary; a gas jetting portion 4 for blowing a gas to a laser-irradiated portion in a direction reverse to the rotation of the wafer and toward the outside thereof obliquely from upside; and a taping device 10 for applying to the wafer after laser irradiation, a tape for protecting the wafer when dicing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
