| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board in which a resistance change of a via hole conductor is small and dimensional accuracy is high in a reliability test, and to provide a method for manufacturing the multilayer wiring board. <P>SOLUTION: The method includes: a process for forming via holes in first and second green sheets and applying first conductor paste to the whole surfaces of inner walls of the via holes to form tubular via hole conductor patterns; a process for filling the insides of the tubular via hole conductor patterns with second conductor pastes having burning shrinkage end temperature lower than the burning shrinkage start temperature of the first conductor paste to form cylindrical via hole conductor patterns; a process for forming surface wiring conductor patterns on the surfaces of the first and second green sheets so as to cover the tubular via hole conductor patterns and the cylindrical via hole conductor patterns; and a process for laminating and burning the first and second green sheets on which the surface wiring conductor patterns are formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
