| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable to prevent a peeling tape adhered to an adhesive sheet from being peeled. <P>SOLUTION: A sheet peeling apparatus 10 makes a supporting means 11 supporting a semiconductor wafer W and a peeling tape PT relatively move by moving means 15 to peel an adhesive sheet S from the semiconductor wafer W. In this peeling step, peeling assistant means 14 contacts with an adhesive surface of the adhesive sheet S peeled so as to oppose to unpeeled adhesive sheet S. The adhesive sheet S is peeled from the semiconductor wafer W while the peeling assistant means 14 supports the peeled adhesive sheet S region on a surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
