| 摘要 |
Provided is a liquid ejection head, comprising a chip having a liquid ejection pressure generating element and an electrode terminal for electrically connecting the liquid ejection pressure generating element to an outside, an electrical wiring board having a lead wiring to be electrically connected to the electrode terminal, and a lead sealing material for covering an electrical connection portion between the electrode terminal and the lead wiring. The lead sealing material contains an epoxy resin (a) which has an average number of functional groups per molecule of more than two and is solid at 25° C., an acid anhydride curing agent (b) having a polybutadiene backbone, a curing accelerator (c), and an inorganic filler (d). |
