MICRO-ELECTROMECHANICAL DEVICE AND USE THEREOF

摘要

The micro-electromechanical device has a substrate (1) suitable for the production of microelectronic components, in particular a semiconductor substrate. Integrated into the substrate (1) is a micromechanical component that has a bending element (4) which can be bent reversibly and which has a first end (34) connected to the substrate (1) and extends from said first end (34) over a free space (3). The bending element (4) has at least one web (8) having two side edges, the course (35) of which is defined by depressions (6) introduced into the bending element (4) and adjacent to the side edges. In order to form a homogenization region located within the web (8), in which mechanical stresses occurring during bending of the bending element (4) are substantially equal, the mutual spacing of the side edges of the web (8) decreases, as viewed from the first end (34) of the bending element (4). The device further comprises at least one microelectronic component (36) that is sensitive to mechanical stresses and embedded in the web (8) in the homogenization region of the latter.