| 摘要 |
<p>PURPOSE: An epoxy resin composition for optical-semiconductor element encapsulation is provided to ensure excellent soldering resistance and curing property as well as good transparency in an available wavelength range. CONSTITUTION: An epoxy resin composition for optical-semiconductor element encapsulation includes: (A) an epoxy resin; (B) a curing agent including a phenol resin(b1) represented by chemicla formula (1), and an acid anhydride(b2) in which R represents -phenyl- or -biphenyl-, and n is 0 or a positive integer; and (C) a curing accelerator, whererin a ratio between the number of hydroxyl groups of the ingredient(b1) and the number of hydroxyl groups of the ingredient(b2), in the ingredient(B) is 99.99/0.01 to 50/50 in terms of b1/b2.</p> |
