CHEMICAL MECHANICAL POLISHING APPARATUS HAVING MULTI-PURPOSE DRAIN PIPE

摘要

PURPOSE: A chemical mechanical polishing apparatus equipped with a multi-purpose drainpipe is provided to minimize a bad effect due to an external shock by extending a signal wire which is extended from a substrate thickness detection sensor to a slip ring. CONSTITUTION: A polishing table(10) in which a platen pad is mounted is rotatively installed. A base plate(60) is installed in the lower part of the polishing table in order to be supported by a frame. A drainpipe(15) is extended from the central part of the polishing table to the lower part. The drainpipe is installed in the polishing table in order to revolve with the polishing table. A substrate thickness detecting sensor senses the thickness of a substrate which is being polished. A drive motor(12) is fixed to the base plate. A power transmission element(13) transfers rotation driving power of the drive motor to the drainpipe.