| 摘要 |
PURPOSE: An intenna manufacturing method is provided to uniformly form the thickness of a plating layer which is formed in the emission pattern part of a base panel and an antenna contacting by generating an emergency signal or stopping electric supply when reaching to desired plating thickness. CONSTITUTION: A metal layer is formed in a base panel with electroless plating(S1). A emission pattern part and an antenna contacting are formed on the surface of the metal layer(S2). A hanger for electroplating is fixed to the emission pattern part and the antenna contacting part(S3). A current accumulation mediation device which is connected to the hanger for electroplating is dipped in an electroplating bath(S4). A conductive layer is formed as the thickness which is fixed in the emission pattern part and the antenna contacting part(S5). A base panel having the emission pattern part and the antenna contacting part in which the conductive layer is formed by the electroplating is dried(S6).
|
