SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and manufacturing method thereof are provided to prevent the generation of void in under fill by injecting resin for forming the under fill through a resin gate. CONSTITUTION: A substrate(100) comprises a resin gate(100a) which is penetrated. A semiconductor chip(120) is flip-chip-bonded in the top of the substrate. A case(150) is combined in the top of the substrate including the semiconductor chip. A filling member(160) is included in an internal space which is formed into the substrate and the case. The filling member comprises an up fill part(162) and an underfill part(161).