SEMICONDUCTOR PACKAGE HAVING DUAL LAND AND RELATED DEVICE

摘要

PURPOSE: A semiconductor package having a double land is provided to offer excellent reliability while controlling thickness by offering a double signal transmission path. CONSTITUTION: A semiconductor chip(41) is electrically connected to inner pads(39). A plurality of lands(37) is electrically connected to the inner pads. One or more roundabout wirings(38) are formed in a substrate. The roundabout wiring is connected to a first land(37A) and a secondary land(37B).